Huadian Technology ›› 2018, Vol. 40 ›› Issue (4): 16-18.
Previous Articles Next Articles
Published:
Abstract:
Key words: ">">ICEPAK;finite element;locally installed device;thermal design
TONG Xingxing, YU Chunlin, DAI Tingzhen, HANG Renping.
/ Recommend
Add to citation manager EndNote|Ris|BibTeX
URL: https://www.hdpower.net/EN/
https://www.hdpower.net/EN/Y2018/V40/I4/16