Abstract: Abstract:The 750kV·A large capacity power electronic module was introduced. The calculation method of power dissipation of the insulated gate bipolar transistor (IGBT) was expounded. A new type water cooling heat sink was designed, and the simulation optimization of the heat sink was carried out by thermal analyzing software system Qfin. The optimal inlet water flow of the water cooling heat sink was selected and verified practically by test platform. The test result shows that the performance of the heat sink can meet the design requirements.

Key words: Key words:general power electronic module, cooling system, insulated grid bipolar transistor (IGBT), power dissipation, water cooling plate heat sink, thermal analysis software system Qfin